LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Window-type ball grid array semiconductor package with lead...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Window-type multi-chip semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Window-type semiconductor package and fabrication method...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Window-type semiconductor package to avoid peeling at...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Windowed and segmented linear geometry source cell for power DMO

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Windowed non-ceramic package having embedded frame

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Windowed package having embedded frame

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Wing-shaped surface mount package for light emitting diodes

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Wire arrayed chip size package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Wire bond interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Wire bond interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Wire bond package with core ring formed over I/O cells

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Wire bond packages for semiconductor chips and related methods a

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Wire bond pad

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Wire bond pad arrangement having improved pad density

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Wire bond pads

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Wire bond-less electronic component for use with an external...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Wire bondable package design with maxium electrical performance

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Wire bonded flip-chip assembly of semiconductor devices