Wire bond interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Reexamination Certificate

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Details

C257S786000, C257SE23024

Reexamination Certificate

active

07453156

ABSTRACT:
A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a diameter of the support pedestal. Also, a semiconductor package including a die mounted onto and electrically connected by a plurality of wire bonds to a substrate, in which each of the wire bonds includes a wire ball bonded to a pad on the die and stitch bonded to a support pedestal on a bond site on a lead finger, and in which the width of the lead finger at the bond site is less than the diameter of the support pedestal.

REFERENCES:
patent: 4742023 (1988-05-01), Hasegawa
patent: 5328079 (1994-07-01), Mathew et al.
patent: 5329157 (1994-07-01), Rosotker
patent: 5340770 (1994-08-01), Allman et al.
patent: 5444303 (1995-08-01), Greenwood et al.
patent: 5465899 (1995-11-01), Quick et al.
patent: 5561086 (1996-10-01), Rostoker
patent: 5654585 (1997-08-01), Nishikawa
patent: 5686762 (1997-11-01), Langley
patent: 5904288 (1999-05-01), Humphrey
patent: 5960262 (1999-09-01), Torres et al.
patent: 5994169 (1999-11-01), Lamson et al.
patent: 6158647 (2000-12-01), Chapman et al.
patent: 6294830 (2001-09-01), Fjelstad
patent: 6329278 (2001-12-01), Low et al.
patent: 6462414 (2002-10-01), Anderson
patent: 6541848 (2003-04-01), Kawahara et al.
patent: 6561411 (2003-05-01), Lee
patent: 6624059 (2003-09-01), Ball
patent: 6713881 (2004-03-01), Umehara et al.
patent: 6787926 (2004-09-01), Chen et al.
patent: 6849931 (2005-02-01), Nakae
patent: 2003/0089521 (2003-05-01), Lee et al.
patent: 2004/0152292 (2004-08-01), Babinetz et al.
patent: 2005/0133928 (2005-06-01), Howard et al.
patent: 2006/0049523 (2006-03-01), Lin
patent: 2006/0102694 (2006-05-01), Lee et al.
International Search Report and Written Opinion for corresponding International Application No. PCT/US05/41116 dated May 07, 2007.

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