Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2005-11-14
2008-11-18
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S786000, C257SE23024
Reexamination Certificate
active
07453156
ABSTRACT:
A wire bond interconnection between a die pad and a bond finger includes a support pedestal at a bond site of the lead finger, a ball bond on the die pad, and a stitch bond on the support pedestal, in which a width of the lead finger at the bond site is less than a diameter of the support pedestal. Also, a semiconductor package including a die mounted onto and electrically connected by a plurality of wire bonds to a substrate, in which each of the wire bonds includes a wire ball bonded to a pad on the die and stitch bonded to a support pedestal on a bond site on a lead finger, and in which the width of the lead finger at the bond site is less than the diameter of the support pedestal.
REFERENCES:
patent: 4742023 (1988-05-01), Hasegawa
patent: 5328079 (1994-07-01), Mathew et al.
patent: 5329157 (1994-07-01), Rosotker
patent: 5340770 (1994-08-01), Allman et al.
patent: 5444303 (1995-08-01), Greenwood et al.
patent: 5465899 (1995-11-01), Quick et al.
patent: 5561086 (1996-10-01), Rostoker
patent: 5654585 (1997-08-01), Nishikawa
patent: 5686762 (1997-11-01), Langley
patent: 5904288 (1999-05-01), Humphrey
patent: 5960262 (1999-09-01), Torres et al.
patent: 5994169 (1999-11-01), Lamson et al.
patent: 6158647 (2000-12-01), Chapman et al.
patent: 6294830 (2001-09-01), Fjelstad
patent: 6329278 (2001-12-01), Low et al.
patent: 6462414 (2002-10-01), Anderson
patent: 6541848 (2003-04-01), Kawahara et al.
patent: 6561411 (2003-05-01), Lee
patent: 6624059 (2003-09-01), Ball
patent: 6713881 (2004-03-01), Umehara et al.
patent: 6787926 (2004-09-01), Chen et al.
patent: 6849931 (2005-02-01), Nakae
patent: 2003/0089521 (2003-05-01), Lee et al.
patent: 2004/0152292 (2004-08-01), Babinetz et al.
patent: 2005/0133928 (2005-06-01), Howard et al.
patent: 2006/0049523 (2006-03-01), Lin
patent: 2006/0102694 (2006-05-01), Lee et al.
International Search Report and Written Opinion for corresponding International Application No. PCT/US05/41116 dated May 07, 2007.
Jang Ki-Youn
Kim Chul-Sik
Kim Jong-Kook
Lee Hun-Teak
Pendse Rajendra D.
Chippac Inc.
Parekh Nitin
LandOfFree
Wire bond interconnection does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Wire bond interconnection, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire bond interconnection will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4033936