Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Patent
1997-03-31
2000-01-11
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With semiconductor element forming part
257666, 257667, 257668, 257691, 257692, 257693, 257697, 257773, 257778, 257787, H01L 2306, H01L 23495, H01L 2302
Patent
active
060139463
ABSTRACT:
A package for a semiconductor chip including a plurality of input/output pads includes an insulating layer and a plurality of conductive traces. The insulating layer has a first surface for bonding with the surface of the semiconductor chip so that the input/output pads are exposed adjacent the insulating layer. The conductive traces are provided on a second surface of the insulating layer opposite the first surface wherein each of the conductive traces corresponds to a respective one of the input/output pads. In particular, the conductive traces are adapted to receive a plurality of bonding wires each of which corresponds to a respective one of the input/output pads. Accordingly, each of the bonding wires can be bonded at a first end to the respective input/output pad and at a second end to the respective conductive trace. Furthermore, the input/output pads can be on an interior portion of the surface of the semiconductor chip, and the insulating layer can have an opening therein for exposing the input/output pads. Accordingly, a dam on the second surface of the insulating layer can be provided around the opening wherein each of the conductive traces extends from adjacent the opening under the dam to a portion of the insulating layer outside the dam. Related methods and assemblies are also discussed.
REFERENCES:
patent: 4218701 (1980-08-01), Shirasaki
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5661086 (1997-08-01), Nakashima et al.
patent: 5677566 (1997-10-01), King et al.
Crowley et al., Chip-Size Packaging Developments, Chapter 2.15 Tessera, Inc., 1995 TechSearch International Inc., pp. 101-109.
Jeong Do Soo
Kim Jae June
Lee Kyu Jin
Chambliss Alonzo
Chaudhuri Olik
Samsung Electronics Co,. Ltd.
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