Windowed non-ceramic package having embedded frame

Details Windowed non-ceramic package having embedded frame Windowed non-ceramic package having embedded frame

1998-12-21

2000-06-06

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

257687, 257434, H01L 310203, H01L 2302, H01L 2322

Patent

active

060722320

ABSTRACT:
An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.

REFERENCES:
patent: 4285002 (1981-08-01), Campbell
patent: 4626960 (1986-12-01), Hamano et al.
patent: 5343076 (1994-08-01), Katayama et al.
patent: 5399805 (1995-03-01), Tyler et al.
patent: 5471011 (1995-11-01), Maslakow
patent: 5498900 (1996-03-01), Dunaway et al.
patent: 5701033 (1997-12-01), Ueda et al.
patent: 5814883 (1998-09-01), Sawai et al.

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