Window-type semiconductor package to avoid peeling at...

Details Window-type semiconductor package to avoid peeling at... Window-type semiconductor package to avoid peeling at...

2008-11-12

2009-12-15

Ha, Nathan W (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257SE23141

Reexamination Certificate

active

07633160

ABSTRACT:
A window-type semiconductor package is disclosed to avoid peeling at the moldflow entrance, primarily comprising a substrate, a chip with the active surface attached to the substrate, a die-attaching layer bonding the active surface of the chip to a substrate core of the substrate, a plurality of bonding wires, and an encapsulant. The substrate core has a slot. One end of the slot outside the chip is formed as a moldflow entrance with two or more moldflow blocking lumps protrusively disposed on the substrate core and located at the intersections between one edge of the chip and the two opposing sides of the slot adjacent to the moldflow entrance. Accordingly, the moldflow pressures exerting at the die-attaching layer are blocked to avoid the peeling of the die-attaching layer at the moldflow entrance and to keep a constant die-attaching gap.

REFERENCES:
patent: 2005/0156300 (2005-07-01), Johnson
patent: 2006/0006508 (2006-01-01), Mitsuhashi
patent: 2006/0055033 (2006-03-01), Kheng
patent: 2008/0090332 (2008-04-01), Cheng et al.
patent: 2008/0090336 (2008-04-01), Huang et al.
patent: 2008/0105974 (2008-05-01), Chen et al.
patent: 2008/0237855 (2008-10-01), Fan et al.
patent: I291751 (2007-12-01), None

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