LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections

Wafer scale integrated circuit and method of forming signal prop

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Wafer scale of full wafer memory system, packaging method thereo

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Wafer scale optoelectronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Wafer scale or full wafer memory system, packaging method thereo

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

Wafer scale package and method of assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Wafer scale packaging scheme

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material

Wafer scale processing

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Wafer scale semiconductor structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Wafer scale thin film package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Wafer sheet with adhesive on both sides and attached...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Wafer stacked package having vertical heat emission path and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Wafer stacked package waving bertical heat emission path and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Wafer stacking using interconnect structures of...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Wafer stacking with anisotropic conductive adhesive

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...

Wafer street buffer layer

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...

Wafer street buffer layer

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding

Wafer structure

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks

Wafer structure in a semiconductor device manufacturing process

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With desiccant – getter – or gas filling

Wafer structure with discrete gettering material