Wafer stacking using interconnect structures of...

Details Wafer stacking using interconnect structures of... Wafer stacking using interconnect structures of...

2006-05-02

2006-05-02

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S621000, C438S109000

Reexamination Certificate

active

07038324

ABSTRACT:
Wafer stacking employing substantially uniform copper structures is described herein.

REFERENCES:
patent: 6106735 (2000-08-01), Kurle et al.
patent: 6558109 (2003-05-01), Gibbel
patent: 6627985 (2003-09-01), Huppenthal et al.
patent: 2004/0262772 (2004-12-01), Ramanathan et al.
patent: 2005/0003650 (2005-01-01), Ramanathan et al.

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