4. Active solid-state devices (e.g., transistors, solid-state diode
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Substrate for photoelectric conversion device, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
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Substrate for pre-soldering material and fabrication method...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
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Substrate for producing a soldering connection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Substrate for producing semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Substrate for reducing electromagnetic interference and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Substrate for resin-encapsulated semiconductor device,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Substrate for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Substrate for semiconductor device and manufacturing method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Substrate for semiconductor device and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Substrate for semiconductor device and semiconductor device usin

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Patent

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Substrate for semiconductor device and semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Substrate for semiconductor device, manufacturing method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
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Substrate for semiconductor device, method of manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material
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Substrate for semiconductor device, resin-sealed...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Substrate for semiconductor device, semiconductor chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
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Substrate for semiconductor light-emitting element,...

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction
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Substrate for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Substrate for semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Substrate for semiconductor package and wire bonding method...

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks
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Substrate for semiconductor package, fabrication method thereof,

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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