Substrate for pre-soldering material and fabrication method...

Details Substrate for pre-soldering material and fabrication method... Substrate for pre-soldering material and fabrication method...

2008-01-15

2008-01-15

Fourson, George R. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257SE23119, C257SE23120, C257SE23121, C257S734000, C257S737000

Reexamination Certificate

active

07319276

ABSTRACT:
A substrate for a pre-soldering material and a fabrication method of the substrate are proposed. The substrate having at least one surface formed with a plurality of conductive pads is provided. An insulating layer is formed over the surface of the substrate in such a way that a top surface of each of the conductive pads is exposed. Next, a conductive film and a resist layer are formed in sequence on the insulating layer and the conductive pads, wherein a plurality of openings are formed in the resist layer to expose a part of the conductive film above the conductive pad. Then, a pre-soldering material is deposited over the conductive pad by stencil printing or electroplating process.

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