Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate
2006-10-31
2006-10-31
Whitehead, Jr., Carl (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
C257S668000, C257S784000, C257S786000, C174S250000, C174S260000, C174S261000
Reexamination Certificate
active
07129578
ABSTRACT:
A lead frame comprises a lead frame body having cut-away portions cut away from the side surfaces of the lead frame body, a die pad for securing a semiconductor chip, bonding electrodes surrounding the die pad, external electrodes for allowing the lead frame to be mounted, wiring for surface treatment extending on the lead frame body with its end being located at a portion of each of the side surfaces of the lead frame body, the portion being opposed to the cut-away portions. The bonding electrode and the wiring for surface treatment, as well as the external electrode and the wiring for surface treatment, are electrically connected, respectively. Even when the lead frame is electrostatically charged by friction with a transfer unit, the semiconductor chip on the lead frame avoids electrostatic damage.
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Jr. Carl Whitehead
Kananen Ronald P.
Mitchell James M.
Rader Fishman & Grauer
Sony Corporation
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