LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Cast metal seal for semiconductor substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Castellation wafer level packaging of integrated circuit chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Castellation wafer level packaging of integrated circuit chips

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure

Casting for an LED module

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal

Catalytic sensor structure

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

Cathode assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Cathode cell design

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Low workfunction layer for electron emission

Cathode ray tube comprising a semiconductor cathode

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Low workfunction layer for electron emission

Cathode structure for reduced emission and robust handling prope

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Cathodic lead insulator

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Cavity ball grid array apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Cavity ball grid array apparatus having improved inductance...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Cavity ball grid array apparatus having improved inductance...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Cavity case with clip/plug for use on multi-media card

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Cavity chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Cavity chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Cavity down ball grid array (CD BGA) package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Cavity down ball grid array package structure and carrier...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Cavity down HBGA package structure