Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2006-09-28
2008-03-04
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S686000, C438S108000, C438S107000
Reexamination Certificate
active
07339278
ABSTRACT:
A package for an IC includes a carrier with a cavity formed on one of the major surfaces. Bumps of a semiconductor die are mated to contact pads located on the bottom of the cavity. The die is attached to the major surface of the carrier. The major surface creates a support which securely holds the chip in place with adhesive for assembly.
REFERENCES:
patent: 6469376 (2002-10-01), Vaiyapuri
patent: 6659512 (2003-12-01), Harper et al.
patent: 6674159 (2004-01-01), Peterson et al.
patent: 2005/0285254 (2005-12-01), Buot et al.
Iksan Henry
Kim Seong Kwang Brandon
Sun Yi Sheng Anthony
Tan Hien Boon
Tanary Susanto
Horizon IP Pte. Ltd.
United Test and Assembly Center Ltd.
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