LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

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Packaging for enhanced thermal and structural performance of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging for high speed integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging for multi-processor shared-memory system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging for semiconductor logic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging high power integrated circuit devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging integrated circuits for high stress environments

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging material for electronic components

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified filler material

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging method and packaging structures of semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging method for microstructure and semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging method for microstructure and semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging method of a plurality of chips stacked on each...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging method, packaging structure and package substrate...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging microelectromechanical structures

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging micromechanical devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging micromechanical devices

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging mold with electrostatic discharge protection

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging multi-chip modules without wire-bond interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging of a microchip device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging of electro-microfluidic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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