Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal
Reexamination Certificate
2008-07-22
2008-07-22
Ha, Nathan W (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Reexamination Certificate
active
07402878
ABSTRACT:
A novel method of packaging electronic devices (e.g. any device that receives or transmits electronic signals) including microelectromechanical devices, semiconductor devices, light emitting devices, light modulating devices, light modulating devices, and light detecting device has been provided herein. The electronic device is placed between two substrates, at least one of which has a cavity for holding the electronic device. The two substrates are then bonded and hermetically sealed with a sealing medium. The adhesion of the sealing medium to the substrates, especially when one of the two substrates is ceramic, can be improved by applying a metallization layer to the surface of the substrate.
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Brady III W. James
Ha Nathan W
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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