Packaged microelectronic devices and methods for assembling...
Packaged microelectronic devices and methods for packaging...
Packaged microelectronic devices and methods for packaging...
Packaged microelectronic devices and methods for...
Packaged microelectronic devices and methods of forming same
Packaged microelectronic devices and methods of forming same
Packaged microelectronic devices including first and second...
Packaged microelectronic devices with a lead frame
Packaged microelectronic devices with interconnecting units
Packaged microelectronic devices with pressure release...
Packaged microelectronic elements with enhanced thermal conducti
Packaged microelectronic imagers and methods of packaging...
Packaged microelectronic imagers and methods of packaging...
Packaged microelectronic imagers and methods of packaging...
Packaged microelectronic imaging devices and methods of...
Packaged microwave semiconductor device
Packaged power devices having vertical power mosfets therein...
Packaged RF power transistor having RF bypassing/output...
Packaged semiconductor assemblies and methods for...
Packaged semiconductor chip