Packaged semiconductor chip

Details Packaged semiconductor chip Packaged semiconductor chip

1996-05-01

1998-09-29

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257700, 257706, 257707, 257675, 257717, 257720, 257704, 257738, H01L 2312, H01L 2348, H01L 2338, H01L 2336

Patent

active

058148833

ABSTRACT:
A semiconductor device includes a substrate having a recess; a semiconductor chip disposed in the recess; a plurality of external electrodes disposed on the substrate; a lid covering the recess; and a heat radiator disposed between the semiconductor chip and the substrate for transmitting heat generated by the semiconductor chip to the substrate for radiation.

REFERENCES:
patent: 4922324 (1990-05-01), Sudo
patent: 5008734 (1991-04-01), Dutta et al.
patent: 5343076 (1994-08-01), Katayama et al.
patent: 5422615 (1995-06-01), Shibagaki et al.
patent: 5455456 (1995-10-01), Newman
patent: 5463250 (1995-10-01), Nguyen et al.
patent: 5491362 (1996-02-01), Hamzehdoost et al.
patent: 5521332 (1996-05-01), Shikata et al.
patent: 5541450 (1996-07-01), Jones et al.

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