Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate
2010-12-23
2011-11-08
Smith, Zandra (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Electromagnetic or particle radiation
C257S234000, C257SE33070
Reexamination Certificate
active
08053857
ABSTRACT:
Methods for forming electrically conductive through-wafer interconnects in microelectronic devices and microelectronic devices are disclosed herein. In one embodiment, a microelectronic device can include a monolithic microelectronic substrate with an integrated circuit has a front side with integrated circuit interconnects thereon. A bond-pad is carried by the substrate and electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the substrate and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad, a dielectric liner deposited into the passage and in contact with the substrate, first and second conductive layers deposited onto at least a portion of the dielectric liner, and a conductive fill material deposited into the passage over at least a portion of the second conductive layer and electrically coupled to the bond-pad.
REFERENCES:
patent: 3345134 (1967-10-01), Heymer et al.
patent: 4534100 (1985-08-01), Lane
patent: 4906314 (1990-03-01), Farnworth et al.
patent: 5130783 (1992-07-01), McLellan
patent: 5371397 (1994-12-01), Maegawa et al.
patent: 5424573 (1995-06-01), Kato et al.
patent: 5435887 (1995-07-01), Rothschild et al.
patent: 5505804 (1996-04-01), Mizuguchi et al.
patent: 5593913 (1997-01-01), Aoki
patent: 5605783 (1997-02-01), Revelli et al.
patent: 5672519 (1997-09-01), Song et al.
patent: 5694246 (1997-12-01), Aoyama et al.
patent: 5708293 (1998-01-01), Ochi et al.
patent: 5771158 (1998-06-01), Yamagishi et al.
patent: 5776824 (1998-07-01), Farnworth et al.
patent: 5811799 (1998-09-01), Wu
patent: 5821532 (1998-10-01), Beaman et al.
patent: 5857963 (1999-01-01), Pelchy et al.
patent: 5861654 (1999-01-01), Johnson
patent: 5877040 (1999-03-01), Park et al.
patent: 5897338 (1999-04-01), Kaldenberg
patent: 5914488 (1999-06-01), Sone
patent: 5977535 (1999-11-01), Rostoker
patent: 5998862 (1999-12-01), Yamanaka
patent: 6080291 (2000-06-01), Woodruff et al.
patent: 6104086 (2000-08-01), Ichikawa et al.
patent: 6114240 (2000-09-01), Akram et al.
patent: 6143588 (2000-11-01), Glenn
patent: 6235554 (2001-05-01), Akram et al.
patent: 6236046 (2001-05-01), Watabe et al.
patent: 6259083 (2001-07-01), Kimura
patent: 6266197 (2001-07-01), Glenn et al.
patent: 6274927 (2001-08-01), Glenn
patent: 6285064 (2001-09-01), Foster
patent: 6351027 (2002-02-01), Giboney et al.
patent: 6372548 (2002-04-01), Bessho et al.
patent: 6407381 (2002-06-01), Glenn et al.
patent: 6411439 (2002-06-01), Nishikawa
patent: 6483652 (2002-11-01), Nakamura
patent: 6503780 (2003-01-01), Glenn et al.
patent: 6534863 (2003-03-01), Walker et al.
patent: 6541762 (2003-04-01), Kang et al.
patent: 6560047 (2003-05-01), Choi et al.
patent: 6566745 (2003-05-01), Beyne et al.
patent: 6603183 (2003-08-01), Hoffman
patent: 6617623 (2003-09-01), Rhodes
patent: 6661047 (2003-12-01), Rhodes
patent: 6667551 (2003-12-01), Hanaoka et al.
patent: 6670986 (2003-12-01), Ben Shoshan et al.
patent: 6686588 (2004-02-01), Webster et al.
patent: 6703310 (2004-03-01), Mashino et al.
patent: 6703689 (2004-03-01), Wada
patent: 6734419 (2004-05-01), Glenn et al.
patent: 6759266 (2004-07-01), Hoffman
patent: 6774486 (2004-08-01), Kinsman
patent: 6778046 (2004-08-01), Stafford et al.
patent: 6791076 (2004-09-01), Webster
patent: 6795120 (2004-09-01), Takagi et al.
patent: 6797616 (2004-09-01), Kinsman
patent: 6800943 (2004-10-01), Adachi
patent: 6813154 (2004-11-01), Diaz et al.
patent: 6825458 (2004-11-01), Moess et al.
patent: 6828663 (2004-12-01), Chen et al.
patent: 6828674 (2004-12-01), Karpman
patent: 6844978 (2005-01-01), Harden et al.
patent: 6864172 (2005-03-01), Noma et al.
patent: 6882021 (2005-04-01), Boon et al.
patent: 6885107 (2005-04-01), Kinsman
patent: 6934065 (2005-08-01), Kinsman
patent: 6946325 (2005-09-01), Yean et al.
patent: 2002/0006687 (2002-01-01), Lam
patent: 2002/0019069 (2002-02-01), Wada
patent: 2002/0057468 (2002-05-01), Segawa et al.
patent: 2002/0089025 (2002-07-01), Chou
patent: 2002/0096729 (2002-07-01), Tu et al.
patent: 2002/0113296 (2002-08-01), Cho et al.
patent: 2002/0145676 (2002-10-01), Kuno et al.
patent: 2003/0062601 (2003-04-01), Harnden et al.
patent: 2004/0012698 (2004-01-01), Suda et al.
patent: 2004/0023469 (2004-02-01), Suda
patent: 2004/0038442 (2004-02-01), Kinsman
patent: 2004/0041261 (2004-03-01), Kinsman
patent: 2004/0082094 (2004-04-01), Yamamoto
patent: 2004/0214373 (2004-10-01), Jiang et al.
patent: 2004/0245649 (2004-12-01), Imaoka
patent: 2005/0029643 (2005-02-01), Koyanagi
patent: 2005/0052751 (2005-03-01), Liu et al.
patent: 2005/0104228 (2005-05-01), Rigg et al.
patent: 2005/0110889 (2005-05-01), Tuttle et al.
patent: 2005/0127478 (2005-06-01), Hiatt et al.
patent: 2005/0151228 (2005-07-01), Tanida et al.
patent: 2005/0236708 (2005-10-01), Farnworth et al.
patent: 2005/0254133 (2005-11-01), Akram et al.
patent: 2005/0275048 (2005-12-01), Farnworth et al.
patent: 2005/0275750 (2005-12-01), Akram et al.
patent: 0886323 (1998-12-01), None
patent: 1157967 (2001-11-01), None
patent: 2835654 (2003-08-01), None
patent: 59101882 (1984-06-01), None
patent: 59191388 (1984-10-01), None
patent: 07263607 (1995-10-01), None
patent: 2001077496 (2001-03-01), None
patent: 9005424 (1990-05-01), None
patent: 02075815 (2002-09-01), None
patent: 02095796 (2002-11-01), None
patent: 03/041174 (2003-05-01), None
patent: 2004054001 (2004-06-01), None
Intrinsic Viscosity and Its Relation to Intrinsic Conductivity, 9 pages, retrieved from the Internet on Oct. 30, 2003, <http://www.ciks.cbt.nist.gov/about.garbocz/paper58
ode3.html>.
King, B. et al., Optomec, Inc., M3D.TM. Technology, Maskless Mesoscale.TM. Materials Deposition, 5 pages, <http://www.optomec.com/downloads/M3D%20White%Paper%20080502.pdf>, retrieved from the Internet on Jun. 17, 2005.
Kingpak Technology, Inc. “CMOS Image Sensor Packaging,” 1 page, retrieved from the Internet on Aug. 26, 2003, <http://www.kingpak.com/CMOSImager.html>.
Kramer, S.J. et al., “Annual Report—Applications of Supercritical Fluid Technology to Semiconductor Device Processing,” pp. 1-29, Nov. 2001.
Kyocera Corporation, Memory Package, 1 page, retrieved from the Internet on Dec. 3, 2004, <http://global.kyocera.com/prdct/semicon/ic.sub.--pkg/memory.sub.--p.h- tml>.
Lin, Tim (Zhigang) and Rick Yoon, “One Package Technique of Exposed MEMS Sensors,” pp. 105-108, 2002 International Symposium on Microelectronics, Sep. 2002.
Ma, X. et al., “Low Temperature Bonding for Wafer Scale Packaging and Assembly of Micromachined Sensors,” Final Report 1998-1999 for MICRO Project 98-144, 3 pages, Department of Electrical & Computer Engineering, University of California, Davis.
Micro Chem, Nano SU-8, Negative Tone Photoresist Formulations 50-100, 4 pages, Feb. 2002, <http://www.microchem.com/products/pdf/SU8.sub.--50-100.pdf>.
Optomec, Inc., M3D.TM. Technology, Maskless Mesoscale Materials Deposition (M3D), 1 page, <http://www.optomec.com/html/m3d.htm>, retrieved from the Internet on Aug. 15, 2003.
Optomec, Inc., M3D.TM., Maskless Mesoscale.TM. Materials Deposition, 2 pages, <http://www.optomec.com/downloads/M3DSheet.pdf>, retrieved from the Internet on Jun. 17, 2005.
Photo Vision Systems, Inc., “Advances in Digital Image Sensors,” 22 pages, First Annual New York State Conference on Microelectronic Design, Jan. 12, 2002.
Shen, X.-J. et al., “Microplastic embossing process: experimental and theoretical characterizations,” Sensors and Actuators, A 97-98 (2002) pp. 428-433, Elsevier Science B.V.
Tapes II International Tape and Fabrication Company, Electronics and Electrical Tapes, 2 pages, 2003, <http://www.tapes2.com/electronics.htm>.
TransChip, 1 page, retrieved from the Internet on Aug. 26, 2003, <http://www.missionventures.com/portfolio/companies/transchip.html>-.
TransChip, Inc., CMOS vs CCD, 3 pages, retrieved from the Internet on Dec. 14, 2005, <http:
Akram Salman
Hiatt William M.
Kirby Kyle K.
Watkins Charles M.
Wood Alan G.
Lerner David Littenberg Krumholz & Mentlik LLP
Perkins Pamela E
Round Rock Research, LLC
Smith Zandra
LandOfFree
Packaged microelectronic imagers and methods of packaging... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Packaged microelectronic imagers and methods of packaging..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaged microelectronic imagers and methods of packaging... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4294724