LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

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Package-integrated thin film LED

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

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Package-level electromagnetic interference shielding

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding

Reexamination Certificate

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Package-on-package secure module having anti-tamper mesh in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

Reexamination Certificate

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Package-on-package system with through vias and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

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Package-on-package system with via Z-interconnections

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

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Package-ready light-sensitive integrated circuit and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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Packaged chip devices with atomic layer deposition...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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Packaged combination memory for electronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Reexamination Certificate

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Packaged device and method of forming same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

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Packaged device and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation

Reexamination Certificate

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Packaged device with thermal enhancement and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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Packaged die on PCB with heat sink encapsulant

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Reexamination Certificate

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Packaged die on PCB with heat sink encapsulant

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Patent

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Packaged die on PCB with heat sink encapsulant and methods

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Reexamination Certificate

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Packaged die PCB with heat sink encapsulant

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaged electronic module and integral sensor array

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Patent

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Packaged electroosmotic pumps using porous frits for cooling...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

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Packaged IC device comprising an embedded flex circuit on...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

Reexamination Certificate

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Packaged image sensing microelectronic devices including a...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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Packaged integrated circuit add-on card

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

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