Packaged device and method of manufacturing the same

Details Packaged device and method of manufacturing the same Packaged device and method of manufacturing the same

2011-03-15

2011-03-15

Le, Thao P. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C438S051000

Reexamination Certificate

active

07906822

ABSTRACT:
A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surface of the device chip.

REFERENCES:
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 6614029 (2003-09-01), Asjes
patent: 6640613 (2003-11-01), Rapp et al.
patent: 6956283 (2005-10-01), Peterson
patent: 7199439 (2007-04-01), Farnworth et al.
patent: 2008/0122055 (2008-05-01), Perkins
patent: 2009/0216149 (2009-08-01), Neff et al.
patent: 2003-19700 (2003-01-01), None
patent: 2003-512621 (2003-04-01), None
patent: 2003-172782 (2003-06-01), None
patent: 2003172782 (2003-06-01), None
patent: 2004-341364 (2004-12-01), None
patent: 2005-504419 (2005-02-01), None
patent: 2006-72252 (2006-03-01), None

Affiliated with

Also associated with

Rating

Packaged device and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaged device and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaged device and method of manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2697101