Package-on-package system with via Z-interconnections

Details Package-on-package system with via Z-interconnections Package-on-package system with via Z-interconnections

2011-01-04

2011-01-04

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S686000, C257S787000, C257SE23116, C257SE23169, C438S109000

Reexamination Certificate

active

07863755

ABSTRACT:
A package-on-package system includes: providing an interposer substrate; mounting a base substrate under the interposer substrate and having a first integrated circuit die connected thereto; forming an encapsulant between the interposer substrate and the base substrate, the encapsulant encapsulating the first integrated circuit die; and forming a via z-interconnection extending through the encapsulant and one of the substrates to the other of the substrates.

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Bart Swinnen and Eric Beyne, 3-D-stacked ICs with Copper Nails, http://ap.pennnet.com/Articles/Article—Display.cfm?Section=ARTCL&ARTICLE—ID=247016&VERSION—NUM=2&p=36, Advanced Packaging, Feb. 2006.

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