Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate
2011-04-12
2011-04-12
Warren, Matthew E (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
C257S698000, C713S178000, C174S050510, C174S261000
Reexamination Certificate
active
07923830
ABSTRACT:
A package-on-package (POP) secure module includes a first ball grid array (BGA) package and a second BGA package. The first BGA includes an array of bond balls that is disposed on a side of a substrate member, and an array of lands that is disposed on the opposite side of the substrate member. Bond balls of the second BGA are fixed to the lands of the first BGA such that the second BGA is piggy-back mounted to the first BGA. Embedded in the substrate member of the second BGA is an anti-tamper security mesh. An integrated circuit in the first BGA is coupled to, drives and monitors the security mesh. When the module is disposed on a printed circuit board within a point of sale (POS) terminal, the integrated circuit is coupled to, also drives and monitors a second security mesh embedded in the printed circuit board underneath the module.
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Pope Steven M.
Zeta Ruben C.
Jiang Fang-Xing
Maxim Integrated Products Inc.
North Weber & Baugh LLP
Warren Matthew E
LandOfFree
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