Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...
Reexamination Certificate
2007-02-20
2010-10-19
Toledo, Fernando L (Department: 2895)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With large area flexible electrodes in press contact with...
C257S666000, C257S670000, C257S672000, C257S676000, C257S678000, C257S686000, C257S690000, C257S693000, C257S700000, C257S723000, C257S724000, C257S777000, C257S778000, C257SE23010, C257SE23031, C257SE23055, C257SE23065, C257SE23078, C257SE25003, C257SE25006
Reexamination Certificate
active
07816778
ABSTRACT:
A device is disclosed which includes a flexible material including at least one conductive wiring trace, a first die including at least an integrated circuit, the first die being positioned above a portion of the flexible material, and an encapsulant material that covers the first die and at least a portion of the flexible material. A method is disclosed which includes positioning a first die above a portion of a flexible material, the first die including an integrated circuit and the flexible material including at least one conductive wiring trace, and forming an encapsulant material that covers the first die and at least a portion of the flexible material, wherein at least a portion of the flexible material extends beyond the encapsulant material.
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International Search Report and Written Opinion for Application No. PCT/US2008/051873.
Corisis David J.
Hui Chong Chin
Lee Choon Kuan
Dulka John P
Micro)n Technology, Inc.
Perkins Coie LLP
Toledo Fernando L
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