Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-07-26
2005-07-26
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S717000, C257S713000, C257S712000, C257S675000
Reexamination Certificate
active
06921974
ABSTRACT:
A plastic ball grid array package has a heat slug which is placed onto the substrate, which has the semiconductor device attached, prior to encapsulation. The heat transfer member is initially located by guide pins and fixed in place by the encapsulation.
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Boon Tan Hien
Gil Park Soo
Hao Liu
Flynn Nathan J.
Greenblum & Bernstein P.L.C.
Mandala Jr. Victor A.
United Test & Assembly Center Ltd.
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