LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Multichip module having a stacked chip arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Multichip module having a stacked chip arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Multichip module having chips mounted on upper and under...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Multichip module having SiO.sub.2 insulating layer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Multichip module having stacked chip arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Multichip module including a plurality of semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Multichip module including substrate with an array of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Multichip module package and fabrication method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Multichip module structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multichip module with built in repeaters and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Multichip module with heat sink and attachment means

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Multichip module, manufacturing method thereof, multichip...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Multichip modules and manufacturing method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Multichip package device having a lead frame with stacked patter

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Multichip package leadframe including electrical bussing

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Multichip package or system-in package

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Multichip package, methods of manufacture thereof and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Multichip packaged semiconductor device and method for manufactu

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Multichip packages with exposed dice