Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2011-04-19
2011-04-19
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S706000, C257S707000, C257S719000, C257SE33075, C257SE31131, C257SE23051
Reexamination Certificate
active
07928564
ABSTRACT:
A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.
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patent: 2004/0212071 (2004-10-01), Moshayedi
Filoteo, Jr. Dario S.
Ho Tsz Yin
Shim Il Kwon
Soon Sebastian T. M.
Clark Jasmine J
Ishimaru Mikio
Stats Chippac Ltd.
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