Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent
1993-06-02
1994-06-21
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
257724, 257783, H01L 2316, H01L 3902
Patent
active
053230604
ABSTRACT:
A multichip module includes: a) a multichip module substrate; b) a first chip, the first chip having opposed base and bonding faces, the base face being adhered to the multichip module substrate, the first chip bonding face including a central area and a plurality of bonding pads peripheral to the central area; c) a second chip, the second chip having opposed base and bonding faces, the second chip bonding face including a central area and a plurality of peripheral bonding pads; d) a first/second adhesive layer interposed between and connecting the first chip bonding face and the second chip base face, the first/second adhesive layer having a thickness and a perimeter, the perimeter being positioned within the central area inside of the peripheral bonding pads; e) a plurality of first loop bonding wires bonded to and between the respective first chip bonding pads and the multichip module substrate, the respective first bonding wires having outwardly projecting loops of a defined loop height, the thickness of the adhesive layer being greater than the loop height to displace the second chip base face in a non-contacting relationship above and with respect to the first wires; and f) a plurality of second loop bonding wires bonded to and between the respective second chip bonding pads and the multichip module substrate.
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Ball Michael B.
Fogal Rich
Guay John F.
Jackson Jerome
Micron Semiconductor Inc.
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