Multichip packaged semiconductor device and method for manufactu

Details Multichip packaged semiconductor device and method for manufactu Multichip packaged semiconductor device and method for manufactu

1992-02-03

1993-09-14

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257723, 257787, H01L 2328

Patent

active

052452158

ABSTRACT:
A plurality of semiconductor chips are mounted on a plurality of islands formed on a lead frame. Inner lead portions of the lead frame and electrode pads formed on the semiconductor chips are electrically connected to one another via first lead portions formed on a flexible resin tape and the electrode pads formed on the semiconductor chips are connected to one another via second lead portions formed on the flexible resin tape. The flexible resin tape on which the islands and inner lead portions of the lead frame, the plurality of semiconductor chips and the first and second lead portions are formed is sealed into a resin package.

REFERENCES:
patent: 4709468 (1987-12-01), Wilson
patent: 4755866 (1988-07-01), Marshall et al.
patent: 5084753 (1992-01-01), Goida et al.
patent: 5138436 (1992-08-01), Koepf
Nikkei Microdevices, pp. 95-101 (Feb., 1989).

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