Multichip packages with exposed dice

Details Multichip packages with exposed dice Multichip packages with exposed dice

2005-08-30

2005-08-30

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S778000, C257S777000

Reexamination Certificate

active

06936929

ABSTRACT:
Multichip packages and methods for making same. The present invention generally allows for either the back of a flipchip, the back of a mother die, or both to be exposed in a multichip package. When the mother die is connected to the package contacts, the back of the flip chip is higher than the electrical connections. Accordingly, the back of the flip chip can be exposed. Furthermore, if a temporary tape substrate is used with a leadframe panel that does not have a die attach pad, the package can be even thinner. Once the temporary tape substrate is removed, both the back of the flipchip and the back of the mother die will be exposed from the encapsulant.

REFERENCES:
patent: 6133637 (2000-10-01), Hikita et al.
patent: 6791195 (2004-09-01), Urushima
patent: 6812552 (2004-11-01), Islam et al.
“Tessara's Unique Approach to Stacked IC Packaging,” downloaded from: http://www.tessara.com/images
ews—events/Stacked—packaging—background er 05-25-01.pdf on Feb. 4, 2003, 4 Pages.

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