Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2008-01-08
2008-01-08
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S723000, C438S107000
Reexamination Certificate
active
07317251
ABSTRACT:
A multichip module includes at least one first semiconductor chip and at least one second semiconductor chip. The semiconductor chips are arranged in coplanar fashion on or in a support medium and respectively include matching components and contact areas arranged on their active top sides. At least one second semiconductor chip includes an arrangement of contact areas which is mirror-inverted in relation to a first semiconductor chip. At least one first semiconductor chip and at least one second semiconductor chip are arranged next to and/or behind one another (i.e., adjacent to one another) such that those of their edges which respectively have a matching arrangement of contact areas are opposite one another. Wiring arrangements extend between respectively opposite contact areas and between contact areas at the outer edges of the semiconductor chips and external contacts.
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Laskar, A.S. and S. Blythe, “Epoxy Multichip Modules: A Solution to the Problem of Packaging and Interconnection of Sensors and Signal-Processing Chips.”,Sensors and Actuators- A Physical, A 36 Mar. 1-27, 1993, No. I, Lausanne, CH.
Clark S. V.
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
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