Multichip package, methods of manufacture thereof and...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

Reexamination Certificate

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Details

C257S707000, C257S706000

Reexamination Certificate

active

07745898

ABSTRACT:
Disclosed herein is a multichip package comprising an optoelectronics assembly; a socket that houses the optoelectronics assembly; the socket being in electrical communication with the optoelectronics assembly; a plate having a first surface and a second surface; the first surface being opposedly disposed to the second surface; a portion of the first surface contacting a portion of the socket to provide thermal contact between the socket and the plate; a serpentine channel being disposed between the plate and the socket to provide a passage for a communication cable that is in operative communication with the optoelectronics assembly; and a heat exchanger in thermal contact with the plate; the heat exchanger being operative to cool the multichip package.

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Giorgio Via. “Liekki, Bookham to Showcase Compatible Optical Engine, Pump Block Unit”. Posted in “Components” on Wednesday, Jan. 17, 2007. 3 pages.

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