Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate
2007-12-20
2010-06-29
Clark, Sheila V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Electromagnetic or particle radiation
C257S707000, C257S706000
Reexamination Certificate
active
07745898
ABSTRACT:
Disclosed herein is a multichip package comprising an optoelectronics assembly; a socket that houses the optoelectronics assembly; the socket being in electrical communication with the optoelectronics assembly; a plate having a first surface and a second surface; the first surface being opposedly disposed to the second surface; a portion of the first surface contacting a portion of the socket to provide thermal contact between the socket and the plate; a serpentine channel being disposed between the plate and the socket to provide a passage for a communication cable that is in operative communication with the optoelectronics assembly; and a heat exchanger in thermal contact with the plate; the heat exchanger being operative to cool the multichip package.
REFERENCES:
patent: 4225213 (1980-09-01), McBride et al.
patent: 4410469 (1983-10-01), Katagiri et al.
patent: 5105429 (1992-04-01), Mundinger et al.
patent: 5495490 (1996-02-01), Rice et al.
patent: 5708743 (1998-01-01), DeAndrea et al.
patent: 6072814 (2000-06-01), Ryan et al.
patent: 6713866 (2004-03-01), Simon et al.
patent: 6898222 (2005-05-01), Hennig et al.
patent: 7084496 (2006-08-01), Benner et al.
patent: 7099533 (2006-08-01), Chenard
patent: 7128472 (2006-10-01), Benner et al.
patent: 7231961 (2007-06-01), Alex et al.
patent: 7348604 (2008-03-01), Matheson
patent: 2004/0021217 (2004-02-01), Epitaux et al.
patent: 2004/0252953 (2004-12-01), Crane et al.
patent: 2006/0045413 (2006-03-01), Weigert
patent: 2008/0185733 (2008-08-01), Furuyama et al.
patent: 2009/0028575 (2009-01-01), Epitaux et al.
patent: 0227114 (1987-07-01), None
Giorgio Via. “Liekki, Bookham to Showcase Compatible Optical Engine, Pump Block Unit”. Posted in “Components” on Wednesday, Jan. 17, 2007. 3 pages.
Campbell Levi A.
DeCusatis Casimer M.
Cantor & Colburn LLP
Clark Sheila V
International Business Machines - Corporation
Monteleone Geraldine
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