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Multi-layer substrate structure for reducing layout area

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Multi-layer substrates and fabrication processes

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Multi-layer tab tape having distinct signal, power and ground pl

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Multi-layer tape having distinct signal, power and ground planes

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Patent

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Multi-layer tunneling device with a graded stoichiometry...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Multi-layer type semiconductor device with semiconductor element

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Plural recrystallized semiconductor layers
Patent

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Multi-layer wiring

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Junction field effect transistor
Patent

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Multi-layer wiring board substrate and semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Multi-layer wiring structure having conductive sidewall etch...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Multi-layer wiring structure having continuous grain boundaries

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Multi-layer wiring structure having narrowed portions at predete

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Patent

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Multi-layer wiring structure having varying-sized cutouts

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections
Patent

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Multi-layer wiring structure with dummy patterns for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Multi-layer, mirror of compound semiconductors including nitroge

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With heterojunction
Patent

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Multi-layered adhesive for attaching a semiconductor die to...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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Multi-layered coaxial interconnect structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Multi-layered complementary conductive line structure

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material
Reexamination Certificate

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Multi-layered complementary wire structure and manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means
Reexamination Certificate

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Multi-layered conducting devices and methods for manufacturing t

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Patent

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Multi-layered copper bond pad for an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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