Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Patent
1996-03-08
1998-06-09
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Beam leads
257666, 257668, 257692, 257696, 257713, 257758, H01L 2348, H01L 2352, H01L 2940, H01L 23495
Patent
active
057639523
ABSTRACT:
One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for mounting a semiconductor die in a semiconductor device assembly. These additional layers are used as separate planes for carrying power and/or ground from outside the assembly to the die, on a separate plane from signals entering or exiting the die. TAB processes are disclosed for cutting, bending and bonding inner and outer portions of selected signal layer traces to respective inner and outer edge portions of the additional conductive layer(s), including a two-stage process of (1) first cutting, bending and tacking the selected traces to the additional layer(s), and then (2) repositioning a bonding tool and securely bonding the selected traces to the additional layer(s). A tool (die pedestal) for aiding in the assembly process is also disclosed.
REFERENCES:
patent: 4800419 (1989-01-01), Long et al.
patent: 4842662 (1989-06-01), Jacobi
patent: 4965702 (1990-10-01), Lott et al.
patent: 4972253 (1990-11-01), Palino et al.
patent: 5409865 (1995-04-01), Karnezos
patent: 5552631 (1996-09-01), McCormick
Lynch Brian
McCormick John
Arroyo Teresa M.
LSI Logic Corporation
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