Multi-layered conducting devices and methods for manufacturing t

Details Multi-layered conducting devices and methods for manufacturing t Multi-layered conducting devices and methods for manufacturing t

1998-01-30

2000-02-29

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Small lead frame for connecting a large lead frame to a...

257666, 257671, H01L 23498

Patent

active

060312777

ABSTRACT:
A multi-layered conductive device is constituted of a plurality of conductive elements disposed in at least two layers, and an insulating film disposed between the respective conductive elements. The multi-layered conductive device may be manufactured by forming a single conductive element, adhering an insulating film to at least one surface of the conductive element, cutting the conductive element to form at least two conductive strips, laminating at least two layers of conducting elements to from a single assembly and fixing the assembly with a resin.

REFERENCES:
patent: 5099306 (1992-03-01), Dunaway et al.
patent: 5681777 (1997-10-01), Lynch et al.

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