LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Low profile ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Low profile ball-grid array package for high power

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Low profile carrier for non-wafer form device testing

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Low profile chip scale stacking system and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Low profile metal-ceramic-metal packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Low profile mounting of thick integrated circuit packages...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Low profile multi-IC chip package connector

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Low profile multi-IC chip package connector

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Low profile multi-IC chip package connector

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Low profile multi-IC chip package connector

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Low profile multi-IC package connector

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Low profile optically-sensitive semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Low profile package for plural semiconductor dies

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Low profile package having multiple die

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Low profile semiconductor device having improved heat...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Low profile semiconductor device with like-sized chip and mounti

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Low profile semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Low profile semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Low profile semiconductor package and process for making the...