Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent
1998-08-21
2000-11-28
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
257685, 257723, 257724, H01L 2302
Patent
active
061539295
ABSTRACT:
A low profile multi-IC chip package for high speed application comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor packages. In one embodiment, the connector comprises a two-part sheet of flexible insulative polymer with buses formed on one side. In another embodiment, the connector comprises multiple buses formed from conductive polymer. In further embodiments, the primary packages are stacked within a cage and have their outer leads in unattached contact with buses within the cage, or, alternatively, are directly fixed to leads or pads on the host circuit board.
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Brooks Jerry M.
King Jerrold L.
Moden Walter L.
Clark Sheila V.
Micro)n Technology, Inc.
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