Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-04-11
2006-04-11
Vigushin, John B. (Department: 2841)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S737000, C257S738000, C257S777000, C257S778000, C361S749000, C361S803000, C438S108000, C438S109000, C438S125000, C438S613000, C029S830000, C029S840000
Reexamination Certificate
active
07026708
ABSTRACT:
The present invention stacks chip scale-packaged integrated circuits (CSPs) into low profile modules that conserve PWB or other board surface area. Low profile contacts are created by any of a variety of methods and materials. A consolidated low profile contact structure and technique is provided for use in alternative embodiments of the present invention. Multiple numbers of CSPs may be stacked in accordance with the present invention. The CSPs employed in stacked modules devised in accordance with the present invention are connected with flex circuitry that exhibit one or two or more conductive layers.
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Buchle Jeff
Cady James W.
Partridge Julian
Roper David L.
Wehrly, Jr. James Douglas
Andrews & Kurth LLP
Denko J. Scott
Staktek Group L.P.
Vigushin John B.
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