Low profile package for plural semiconductor dies

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S723000, C257S686000

Reexamination Certificate

active

06452278

ABSTRACT:

BACKGROUND OF THE INVENTION
Modern electronic devices, such as portable telephones and pagers, are becoming increasingly complex, while continually shrinking in size. Accordingly, the semiconductor chips (also called “die”) that are used within those electronic devices, such as microprocessor chips and memory chips, must be packaged in packages that are highly functional, yet small in size. In addition, the packages must have good heat dissipation capabilities.
SUMMARY OF THE INVENTION
The present invention includes package embodiments that are very thin and have excellent heat dissipation capabilities. Moreover, the packages are highly functional. For example, the packages may accommodate one die or a plurality of stacked die, and also may accommodate passive devices in addition to the die(s).
One embodiment of a package within the present invention includes a substrate having opposed top and bottom surfaces and an aperture therebetween. The substrate includes an insulative layer and at least top and bottom metal layers on the insulative layer around the aperture. The metal layers are electrically connected through the insulative layer. At least one die is supported within the aperture by an insulative encapsulant material. The bottom surface of the die is exposed. In alternative embodiments, a stack of dies (e.g., two die) is supported in the aperture. Rectangular metal input/output contacts, which are electrically connected to the die, are provided in a single row on the bottom surface of the substrate along at least two edges of the package. Alternatively, a checkerboard array of metal input/output contacts may be formed on the bottom surface of the substrate around the aperture.
In alternative embodiments, a pair of die are stacked in the aperture. The lower surface of the lower die is exposed.
These and other features of the present invention will become apparent in light of the following detailed description.


REFERENCES:
patent: 3851221 (1974-11-01), Beaulieu et al.
patent: 4567643 (1986-02-01), Droguet et al.
patent: 4730232 (1988-03-01), Lindberg
patent: 4763188 (1988-08-01), Johnson
patent: 4982265 (1991-01-01), Watanabe et al.
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5012323 (1991-04-01), Farnworth
patent: 5025306 (1991-06-01), Johnson et al.
patent: 5040052 (1991-08-01), McDavid
patent: 5138438 (1992-08-01), Masayuki et al.
patent: 5140404 (1992-08-01), Fogal et al.
patent: 5165067 (1992-11-01), Wakefield et al.
patent: 5198888 (1993-03-01), Sugano et al.
patent: 5200362 (1993-04-01), Lin et al.
patent: 5229647 (1993-07-01), Gnadinger
patent: 5273938 (1993-12-01), Lin et al.
patent: 5291061 (1994-03-01), Ball
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5334875 (1994-08-01), Sugano et al.
patent: 5347429 (1994-09-01), Kohno et al.
patent: 5422435 (1995-06-01), Takiar et al.
patent: 5426563 (1995-06-01), Moresco et al.
patent: 5432729 (1995-07-01), Carson et al.
patent: 5436203 (1995-07-01), Lin
patent: 5463253 (1995-10-01), Wali et al.
patent: 5473196 (1995-12-01), De Givry
patent: 5474958 (1995-12-01), Djennas et al.
patent: 5495394 (1996-02-01), Kornfeld et al.
patent: 5495398 (1996-02-01), Takiar et al.
patent: 5502289 (1996-03-01), Takiar et al.
patent: 5514907 (1996-05-01), Moshayedi
patent: 5545922 (1996-08-01), Golwalkar et al.
patent: 5569625 (1996-10-01), Yoneda et al.
patent: 5581498 (1996-12-01), Ludwig et al.
patent: 5587341 (1996-12-01), Masayuki et al.
patent: 5604376 (1997-02-01), Hamburgen et al.
patent: 5614766 (1997-03-01), Takasu et al.
patent: 5620928 (1997-04-01), Lee et al.
patent: 5637536 (1997-06-01), Val
patent: 5637912 (1997-06-01), Cockerill et al.
patent: 5646828 (1997-07-01), Degani et al.
patent: 5682062 (1997-10-01), Gaul
patent: 5689135 (1997-11-01), Ball
patent: 5696031 (1997-12-01), Wark
patent: 5715147 (1998-02-01), Nagano
patent: 5721452 (1998-02-01), Fogal et al.
patent: 5739581 (1998-04-01), Chillara et al.
patent: 5783870 (1998-07-01), Mostafazadeh et al.
patent: 5793108 (1998-08-01), Nakahishi et al.
patent: 5798014 (1998-08-01), Weber
patent: 5815372 (1998-09-01), Gallas
patent: 5835355 (1998-11-01), Dordi
patent: 5861666 (1999-01-01), Bellaar
patent: 5866949 (1999-02-01), Schueller
patent: 5872025 (1999-02-01), Cronin et al.
patent: 5885849 (1999-03-01), DiStefano et al.
patent: 5886412 (1999-03-01), Fogal et al.
patent: 5894108 (1999-04-01), Mostafazadeh et al.
patent: 5903052 (1999-05-01), Chen et al.
patent: 5917242 (1999-06-01), Ball
patent: 5952611 (1999-09-01), Eng et al.
patent: 5973403 (1999-10-01), Wark
patent: 5977640 (1999-11-01), Bertin et al.
patent: 5986317 (1999-11-01), Wiese
patent: 6001671 (1999-12-01), Fjelstad
patent: 6005778 (1999-12-01), Spielberger et al.
patent: 6013948 (2000-01-01), Akram et al.
patent: RE36613 (2000-03-01), Ball
patent: 6034427 (2000-03-01), Lan et al.
patent: 6051886 (2000-04-01), Fogal et al.
patent: 6057598 (2000-05-01), Payne et al.
patent: 6060778 (2000-05-01), Jeong et al.
patent: 6072243 (2000-06-01), Nakanishi
patent: 6080264 (2000-06-01), Ball
patent: 6100804 (2000-08-01), Brady et al.
patent: 6107689 (2000-08-01), Kozono
patent: 6118184 (2000-09-01), Ishio et al.
patent: 6126428 (2000-10-01), Mitchell et al.
patent: 6127833 (2000-10-01), Wu et al.
patent: 6133637 (2000-10-01), Hikita et al.
patent: 6160705 (2000-12-01), Stearns et al.
patent: 6172419 (2001-01-01), Kinsman
patent: 6184463 (2001-02-01), Panchou et al.
patent: 6198171 (2001-03-01), Huang et al.
patent: 6214641 (2001-04-01), Akram
patent: 6235554 (2001-05-01), Akram et al.
patent: 503 201 (1991-12-01), None
patent: 54-128274 (1979-04-01), None
patent: 56062351 (1981-05-01), None
patent: 60182731 (1985-09-01), None
patent: 61059862 (1986-03-01), None
patent: 61117858 (1986-06-01), None
patent: 62-12661 (1987-06-01), None
patent: 62119952 (1987-06-01), None
patent: 62126661 (1987-06-01), None
patent: 62142341 (1987-06-01), None
patent: 63128736 (1988-06-01), None
patent: 63211663 (1988-09-01), None
patent: 63244654 (1988-10-01), None
patent: 63-244654 (1988-10-01), None
patent: 1028856 (1989-01-01), None
patent: 64001269 (1989-01-01), None
patent: 1071162 (1989-03-01), None
patent: 1099248 (1989-04-01), None
patent: 3169062 (1991-07-01), None
patent: 4028260 (1992-01-01), None
patent: 4-56262 (1992-02-01), None
patent: 4056262 (1992-02-01), None
patent: 4096358 (1992-03-01), None
patent: 4116859 (1992-04-01), None
patent: 4-368154 (1992-12-01), None
patent: 4-368167 (1992-12-01), None
patent: 5013665 (1993-01-01), None
patent: 5-75015 (1993-03-01), None
patent: 5109975 (1993-04-01), None
patent: 5136323 (1993-06-01), None
patent: 5-283601 (1993-10-01), None
patent: 10-256470 (1998-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Low profile package for plural semiconductor dies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low profile package for plural semiconductor dies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low profile package for plural semiconductor dies will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2856232

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.