Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent
1992-06-09
1995-08-29
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
257679, 257701, 257703, 257705, 257774, H01L 2302, H01L 2312, H01L 2316, H01L 2342
Patent
active
054463149
ABSTRACT:
A heat-conductive honeycomb ceramic spacer having an array of apertures for facilitating assembly of a semiconductor device including a plurality of semiconductor stacks using a low-profile contact comprising a foil with raised portions corresponding to the locations of apertures in the ceramic spacer for forming contacts with the semiconductor stacks when the spacer and the stacks are sandwiched between the foil and another conductive sheet. Use of such a foil also allows disconnection of defective stacks in the device. Extra stacks are provided to compensate for defective stacks, according to an n-x design philosophy. Solder preforms may be included on the stacks and enhanced connections made to the foil of conductive sheet by causing reflux of the solder preforms. The invention may also be applied to multi-layer device constructions.
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patent: 2786167 (1957-03-01), Esseling
patent: 2791731 (1957-05-01), Walker et al.
patent: 3231794 (1966-01-01), Diebold
patent: 3266125 (1966-08-01), Tobolski
patent: 3388302 (1968-06-01), McManus
patent: 3476985 (1969-11-01), Magner et al.
patent: 4021839 (1977-05-01), Denlinger
patent: 4554574 (1985-11-01), Wright
patent: 4649418 (1987-03-01), Uden
Melnick Paul J.
Mennella, Jr. Anthony J.
Meyer Herman P.
International Business Machines - Corporation
Jackson Jerome
Jr. Carl Whitehead
Kinnaman William A.
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