Low profile semiconductor package

Details Low profile semiconductor package Low profile semiconductor package

1998-07-22

2000-09-05

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

257786, 257787, 257737, H01L 2348, H01L 2352, H01L 2940

Patent

active

061147702

ABSTRACT:
An embodiment of an inventive semiconductor device comprises an unpackaged semiconductor wafer section having a major surface with a plurality of bond pads thereon. A plurality of conductors each comprise a lead member and at least a portion formed within a matrix. The conductors are attached to the major surface of the wafer section. An electrical connection electrically couples each of the bond pads with at least one of the lead members. Sealing material is then formed to contact at least the bond pads and the lead members.

REFERENCES:
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patent: 4622574 (1986-11-01), Garcia
patent: 4901136 (1990-02-01), Neugebauer et al.
patent: 4922324 (1990-05-01), Sudo
patent: 5045921 (1991-09-01), Lin et al.
patent: 5218234 (1993-06-01), Thompson et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5302849 (1994-04-01), Cavasin
patent: 5360992 (1994-11-01), Lowrey et al.
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5753974 (1998-05-01), Masukawa
"Z-Axis Conductive Adhesive", Zymet Inc., 7 Great Meadow Lane, E. Hanover, NJ 07936, Aug. 1, 1990.

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