LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Electronic package with strengthened conductive pad

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Electronic package with stress relief channel

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Electronic package with surface-mountable device built therein

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Electronic package with thermally conductive support member havi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Electronic package with thermally conductive support member havi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Electronic package with thermally conductive support member havi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Electronic package with thermally-enhanced lid

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation

Electronic packages and smart structures formed by thermal spray

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Electronic packages with dice landed on wire bonds

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Electronic packaging for optical emitters and sensors

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Electronic packaging including die with through silicon via

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip

Electronic packaging including die with through silicon via

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Electronic packaging shaped beam lead fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Electronic packaging using conductive interproser connector

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Electronic packaging with varying height connectors

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Electronic part

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond

Electronic part

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Electronic part and its manufacturing method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Electronic part and surface treatment method of the same