Electronic part and surface treatment method of the same

Details Electronic part and surface treatment method of the same Electronic part and surface treatment method of the same

2007-06-19

2007-06-19

Tran, Minh-Loan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S772000, C257S781000, C257SE23023

Reexamination Certificate

active

10986814

ABSTRACT:
There is provided a surface treatment method for an electronic part, which uses a metal not containing lead and tin and having excellent solder wettability, is economical and has high reliability. In the surface treatment method for the electronic part in which a soldered part is subjected to a surface treatment of structure of three layers of nickel, palladium and gold, the palladium layer and the gold layer are formed by an electrolytic plating treatment, a thickness of the palladium layer is in a range of 0.007 to 0.1 μm, a thickness of the gold layer is in a range of 0.003 to 0.02 μm, and a relation of the thickness of the gold layer<the thickness of the palladium layer is established.

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Abbott, D., Romm, D., Lange, B., A Nickel-Palladium Integrated Circuit Lead Finish and Its Potential for Solder-Joint Embrittlement, Dec. 2001, Texas Instruments Application Report pp. 1-4□□URL: http://focus.ti.com/lit/an/szza031/szza031.pdf.
Internet official homepage of Nagano prefecture, Feb. 17, 2003, 15 pp.

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