Electronic package with strain relief means

Details Electronic package with strain relief means Electronic package with strain relief means

1996-02-01

1998-06-02

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With stress relief

257676, 257701, 257738, 361749, 361776, 439 67, H01L 23495, H01L 2312

Patent

active

057604657

ABSTRACT:
An electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements.

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