Electronic packaging shaped beam lead fabrication

Details Electronic packaging shaped beam lead fabrication Electronic packaging shaped beam lead fabrication

1995-10-13

1998-03-31

Whitehead, Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257735, H01L 23495, H01L 2302

Patent

active

057341966

ABSTRACT:
An electronic packaging interface between conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.

REFERENCES:
patent: 4125740 (1978-11-01), Paletto
patent: 4618879 (1986-10-01), Mizukoshi et al.
patent: 4866504 (1989-09-01), Landis
patent: 5083191 (1992-01-01), Ueda
patent: 5117275 (1992-05-01), Bregman et al.
Microelectronics Packaging Handbook Edited by Rao R. Tummala and Eugene J. Rymaszewski, Van Nostrand (1989) pp. 409-431.
"Comparative Compliance of Representative Lead Designs For Surface Mounted Components" by Robert W. Kotlowitz, 1989 Proceedings of the 39th Electronic Components Conference, pp. 791-831.

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