Electronic packaging including die with through silicon via

Details Electronic packaging including die with through silicon via Electronic packaging including die with through silicon via

2008-01-08

2008-01-08

Parker, Kenneth (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257SE27137, C257S723000, C257S685000, C257S686000, C438S108000, C438S109000, C361S760000

Reexamination Certificate

active

07317256

ABSTRACT:
An apparatus, method, and system for electronic device packaging having stacked dice are disclosed herein. A first die has a through silicon via formed therethrough. A second die is landed on the through silicon via of the first die. A mount having a lead is coupled to the through silicon via of the first die.

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“Through-Silicon Contacts,” Tru-Si Technologies, http://web.archive.org/web/20010629231505/http://www.trusi.com/throughsiliconvias.html, 1 pg.

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