Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Patent
1991-07-15
1994-01-11
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Physical deformation
257467, 257687, 257706, 257729, H01L 2302
Patent
active
052784428
ABSTRACT:
A smart structure or an electronic package is formed by thermal spraying utilizing a plurality of masks positioned and removed over a work surface in accordance with a predetermined sequence. The masks correspond to cross sections normal to a centerline through the structure. Masks are placed above a work surface and sprayed with either at least one primary material to form at least one electronic component and a complementary material. In this manner, layers of material form a block of deposition material and complementary material. Then, the complementary material which serves as a support structure during forming may be removed.
REFERENCES:
patent: 3880633 (1975-04-01), Jordan et al.
patent: 4471369 (1984-09-01), Anthony et al.
patent: 4665492 (1987-05-01), Masters
patent: 4685081 (1987-08-01), Richman
patent: 4709254 (1987-11-01), Haghiri-Tehrani et al.
patent: 4752352 (1988-06-01), Feygin
patent: 4811082 (1989-03-01), Jacobs et al.
patent: 4924291 (1990-05-01), Lesk et al.
patent: 4972253 (1990-11-01), Palino et al.
patent: 4982311 (1991-01-01), Dehaine et al.
patent: 5048179 (1991-09-01), Shindo et al.
"Three Dimensional Printing: Ceramic Tooling and Parts Directly From a CAD Model" by Emanuel E. Sachs, Michael Cima, James Cornie, David Brancazio and Alan Curodeau submitted to the National Rapid Prototyping Conference, Dayton, Ohio, Jun. 4-5, 1990.
"Automated Fabrication of Net Shape Microcrystalline and Composite Metal Structures Without Molds" by David Fauber, pp. 461-466, published in Manufacturing Processes, Systems and Machines, 14th Conference on Production, Research and Technology, National Science Foundation, Ann Arbor, Mich., Oct. 6-9, 1987.
"A Rapid Tool Manufacturing System Based on Stereolithography and Thermal Spraying" by Lee E. Weiss, E. Levent Cursoz, F. B. Prinz, Paul S. Fussell, Swami Mahalingham and E. P. Patrick, published by the American Society of Mechanical Engineers, 1990, pp. 40-48.
Product Sheet of Cerro Metal Products "Cerro Alloy Physical Data Applications".
"DC Arc-Plasma-The Future in The P/M Industry?" by Douglas H. Harris published by ASP-Materials, Inc., Dayton, Ohio.
"Polycrystalline Ferrite Films for Microwave Applications Deposited by Arc-Plasma" by D. H. Harris, J. R. Janowiecki, C. E. Semler, M. C. Willson and J. T. Cheng published in the Journal of Applied Physics, vol. 41, No. 2, 1 Mar., 1970.
Prinz Fritz B.
Siewiorek Daniel P.
Weiss Lee E.
Alstadt Lynn J.
Hille Rolf
Ingersoll Buchanan
Potter Roy
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