LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Light emitting diode package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Light emitting diode package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Light-emitting device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

LOC (lead on chip) package and fabricating method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

LOC semiconductor assembled with room temperature adhesive

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

LOC semiconductor assembled with room temperature adhesive

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

LOC semiconductor assembled with room temperature adhesive

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

LOC semiconductor assembled with room temperature adhesive

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

LOC semiconductor assembled with room temperature adhesive

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

LOC semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

LOC semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Low cost heat sink for packaged semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Low cost lead-free preplated leadframe having improved...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Low cost method to produce high volume lead frames

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Low cost method to produce high volume lead frames

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Low cost power MOSFET with current monitoring

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Low dielectric constant interconnect for multichip modules

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Low inductance lead frame for a semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Low inductance leadless package