Low cost method to produce high volume lead frames

Details Low cost method to produce high volume lead frames Low cost method to produce high volume lead frames

2008-05-06

2008-05-06

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257S670000, C257S677000, C257SE23031, C257SE23050, C257SE23043, C257SE23054, C438S123000

Reexamination Certificate

active

11679007

ABSTRACT:
A method (300) for fabricating a lead frame (100), comprising forming a plurality of external leads (122) in a lead frame material (108), plating a metal (222) on all surfaces of the lead frame material (108), and subsequently forming a plurality of internal leads (124) in the lead frame material (108). The lead frame material (108) may comprise of a portion of a contiguous metal sheeting (204) rolled upon a first coil (202), wherein the contiguous metal sheeting (204) is fed into an external lead stamping apparatus (206), thus forming the external leads (122), and rolled onto a second coil (215). The portion is fed into a plating apparatus and plated with the metal (222), and rolled onto a third coil (218) prior to forming the plurality of internal leads (124). The third coil (218) can be unrolled into an internal lead stamping apparatus (226), thus forming the internal leads (124) of a lead frame (100). The lead frame (100) is cleaned and subsequently rolled onto a fourth coil (238) to be cut into sheets (240).

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