Low inductance lead frame for a semiconductor package

Details Low inductance lead frame for a semiconductor package Low inductance lead frame for a semiconductor package

1993-02-26

1994-05-03

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

257666, 257676, 257669, 257674, 257773, 257776, 257784, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

053090195

ABSTRACT:
A low inductance lead frame (10) is formed to have a die attach area (11). A plurality of intermediate connection bars (12,13,14,15) are positioned to be parallel to sides of the die attach area (11), and to be in a plane that is displaced perpendicularly from the die attach area (11). Each end of each intermediate connection bar is separated from an end of each other intermediate connection bar. Supports (17) extend from the die attach area (11) to the intermediate connection bars (12,13,14,15) to provide support for the intermediate connection bars 12,13,14,15). A plurality of leads (19,33,34) are positional in a plane and have a proximal end near the intermediate connection bars (12,13,14,15).

REFERENCES:
patent: 4829362 (1989-05-01), Tran et al.
patent: 4994895 (1991-02-01), Matsuzaki et al.

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