LOC semiconductor assembled with room temperature adhesive

Details LOC semiconductor assembled with room temperature adhesive LOC semiconductor assembled with room temperature adhesive

2005-12-27

2005-12-27

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

C257S666000, C257S676000, C257S783000, C257S310000, C257S643000, C257S669000, C257S674000, C257S668000, C257S671000

Reexamination Certificate

active

06979888

ABSTRACT:
A semiconductor device assembly having a lead frame and a semiconductor die configured to be attached to each other is disclosed. An adhesive is applied at room temperature through a stencil to the lead frame. The semiconductor die is urged against the adhesive to effect the attachment between the semiconductor device and the lead frame. The adhesive preferably is from about 75 percent to about 95 percent isobutyl acetal diphenol copolymer and from about 25 percent to about 5 percent, respectively, of titanium oxide.

REFERENCES:
patent: 4934820 (1990-06-01), Takahashi et al.
patent: 4937656 (1990-06-01), Kohara
patent: 5073521 (1991-12-01), Braden
patent: 5256598 (1993-10-01), Farnworth et al.
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5304582 (1994-04-01), Ogawa
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5350811 (1994-09-01), Ichimura et al.
patent: 5366933 (1994-11-01), Golwalkar et al.
patent: 5407502 (1995-04-01), Takenaka et al.
patent: 5441918 (1995-08-01), Morisaki et al.
patent: 5446080 (1995-08-01), Shima et al.
patent: 5506446 (1996-04-01), Hoffman et al.
patent: 5548160 (1996-08-01), Corbett et al.
patent: 5627108 (1997-05-01), Alibocus et al.
patent: 5755867 (1998-05-01), Chikuni et al.
patent: 5840598 (1998-11-01), Grigg et al.
patent: 5863988 (1999-01-01), Hashimoto et al.
patent: 5872398 (1999-02-01), King et al.
patent: 5959347 (1999-09-01), Grigg et al.
patent: 5982041 (1999-11-01), Mitani et al.
patent: 6011220 (2000-01-01), Bando et al.
patent: 6012502 (2000-01-01), VanNortwick et al.

Affiliated with

Also associated with

Rating

LOC semiconductor assembled with room temperature adhesive does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with LOC semiconductor assembled with room temperature adhesive, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and LOC semiconductor assembled with room temperature adhesive will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3519669