LOC semiconductor package

Details LOC semiconductor package LOC semiconductor package

1998-02-13

2000-05-23

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257669, 257691, H01L 23495

Patent

active

060668873

ABSTRACT:
A semiconductor package includes a semiconductor chip having a plurality of bonding pads on its top surface, a plurality of inner leads located above the semiconductor chip and electrically connected to the bonding pads by wire, a plurality of outer leads extending from the respective inner leads, and at least one bus bar formed lower than the inner leads, to prevent electrical shorts and improve reliability of the package.

REFERENCES:
patent: 5227232 (1993-07-01), Lim
patent: 5252853 (1993-10-01), Michii
patent: 5286999 (1994-02-01), Chiu

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